Spectrum at DSEI 2017 – Booth N8-375

Spectrum Technologies are pleased to announce their participation in DSEI 2017 at the ExCel in London from 12-15th September 2017.

DSEI is is the world leading event that brings together the global defence and security sector to innovate and share knowledge.

Spectrum will be located in the Land Zone and will be represented by Peter Dickinson, Madeleine Pinder and Fabio De Gioannini.

Our product line includes:

  • UV Laser & ink-jet wire marking systems – CAPRIS® & Nova™ ranges offering automated laser mark, measure and cut capabilities for low volume MRO activities up to high throughput production.  Ink-Jet versions also available – Nova Jet™
  • Laser wire stripping systems – SIENNA ranges for the removal of polymer insulations as well as the ablation of enamel coatings on magnet wire. Systems available for processing cable up to 25mm diameter.
  • Wire measure & cut systems – Nova MaX, for high performance cutting to length of wire & cable up to 16mm diameter.
  • Automation & wire processing accessories – Everything you need to enhance the performance of your wire marking system and ensure you get the maximum output from it.

To find out more, visit our Booth : N8-375